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Mechanics of Microelectronics - Driel, W.D. van;Zhang, G.Q.;Fan, X.J.
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Driel, W.D. van;Zhang, G.Q.;Fan, X.J.:

Mechanics of Microelectronics - Paperback

2010, ISBN: 9789048172313

[ED: Softcover], [PU: Springer / Springer Netherlands], This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the mi… More...

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Mechanics of Microelectronics - G.Q. Zhang|W.D. van Driel|X.J. Fan
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G.Q. Zhang|W.D. van Driel|X.J. Fan:

Mechanics of Microelectronics - Paperback

2010, ISBN: 9048172314

[EAN: 9789048172313], Neubuch, [PU: Springer Netherlands], COMPUTER-AIDEDDESIGN(CAD) SIMULATION DESIGN DEVELOPMENT ELECTRONICPACKAGING MECHANICALENGINEERING MODELING OPTIMIZATION RELIABIL… More...

NEW BOOK. Shipping costs: EUR 11.72 moluna, Greven, Germany [73551232] [Rating: 4 (von 5)]
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Mechanics of Microelectronics - G.Q. Zhang W.D. van Driel X.J. Fan
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G.Q. Zhang W.D. van Driel X.J. Fan:
Mechanics of Microelectronics - First edition

2010

ISBN: 9789048172313

Paperback

[ED: Kartoniert / Broschiert], [PU: Springer Netherlands], Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers issues essential for cur… More...

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Mechanics of Microelectronics - G.Q. Zhang W.D. van Driel X.J. Fan
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G.Q. Zhang W.D. van Driel X.J. Fan:
Mechanics of Microelectronics - First edition

2010, ISBN: 9789048172313

Paperback

[ED: Kartoniert / Broschiert], [PU: Springer Netherlands], Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers issues essential for cur… More...

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Mechanics of Microelectronics - Zhang, G. Q.; Fan, X. J.; Driel, W. D. Van
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Zhang, G. Q.; Fan, X. J.; Driel, W. D. Van:
Mechanics of Microelectronics - Paperback

2010, ISBN: 9048172314

Hardcover

Softcover reprint of hardcover 1st ed. 2006 Kartoniert / Broschiert Künstliche Intelligenz, Virtualprototyping; computer-aideddesign(CAD); Simulation; Design; Development; electronicpac… More...

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Bibliographic data of the best matching book

Details of the book
Mechanics of Microelectronics
Author:
Title:
ISBN:

9789048172313


This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Details of the book - Mechanics of Microelectronics


EAN (ISBN-13): 9789048172313
ISBN (ISBN-10): 9048172314
Hardcover
Paperback
Publishing year: 2010
Publisher: Springer
584 Pages
Weight: 0,918 kg
Language: eng/Englisch

Book in our database since 2011-09-27T14:16:06+01:00 (London)
Detail page last modified on 2023-06-10T13:36:52+01:00 (London)
ISBN/EAN: 9789048172313

ISBN - alternate spelling:
90-481-7231-4, 978-90-481-7231-3
Alternate spelling and related search-keywords:
Book author: fan, van driel, zhang
Book title: microelectronics, zhang

Information from Publisher

Author: G.Q. Zhang
Title: Solid Mechanics and Its Applications; Mechanics of Microelectronics
Publisher: Springer; Springer Netherland
566 Pages
Publishing year: 2010-11-22
Dordrecht; NL
Printed / Made in
Language: English
219,99 € (DE)

BC; Hardcover, Softcover / Technik/Maschinenbau, Fertigungstechnik; Maschinenbau; Verstehen; Computer-Aided Design (CAD); Simulation; design; development; electronic packaging; mechanical engineering; mechanics; microelectronics; modeling; optimization; reliability; stability; statistics; thermo-mechanics; virtual prototyping; Engineering Mechanics; Mechanical Engineering; Computational Intelligence; Künstliche Intelligenz; BB; EA

Microelectronics Technology.- Reliability Practice.- Thermal Management.- to Advanced Mechanics.- Thermo-Mechanics of Integrated Circuits and Packages.- Characterization and Modelling of Moisture Behaviour.- Characterization and Modelling of Solder Joint Reliability.- Virtual Thermo-Mechanical Prototyping.- Challenges and Future Perspectives.
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