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Introduction to Microsystem Packaging Technology Yufeng Jin Author
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ISBN: 9781439819104

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—inclu… More...

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Introduction to Microsystem Packaging Technology by Jing, Jin, Yufeng, Wang, Zhiping Chen - Jing, Jin, Yufeng, Wang, Zhiping Chen
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Introduction to Microsystem Packaging Technology by Jing, Jin, Yufeng, Wang, Zhiping Chen - used book

ISBN: 9781439819104

Vastly ahead of the field, this resource demonstrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. It a… More...

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Introduction to Microsystem Packaging Technology - Jin, Yufeng (Peking University), Wang, Zhiping, Chen, Jing (Peking University)
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Jin, Yufeng (Peking University), Wang, Zhiping, Chen, Jing (Peking University):
Introduction to Microsystem Packaging Technology - hardcover

2010

ISBN: 9781439819104

Taylor & Francis Inc, Gebundene Ausgabe, Auflage: UK ed. 232 Seiten, Publiziert: 2010-09-23T00:00:01Z, Produktgruppe: Book, Hersteller-Nr.: 138 black & white illustrations, 16 blac, 1.5 k… More...

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Introduction to Microsystem Packaging Technology - Jin, Yufeng (Peking University), Wang, Zhiping, Chen, Jing (Peking University)
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Jin, Yufeng (Peking University), Wang, Zhiping, Chen, Jing (Peking University):
Introduction to Microsystem Packaging Technology - hardcover

2010, ISBN: 9781439819104

Taylor & Francis Inc, Gebundene Ausgabe, Auflage: UK ed. 232 Seiten, Publiziert: 2010-09-23T00:00:01Z, Produktgruppe: Book, Hersteller-Nr.: 138 black & white illustrations, 16 blac, 1.5 k… More...

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Introduction to Microsystem Packaging Technology - Yufeng Jin
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Yufeng Jin:
Introduction to Microsystem Packaging Technology - hardcover

ISBN: 9781439819104

Introduction to Microsystem Packaging Technology Introduction-to-Microsystem-Packaging-Technology~~Yufeng-Jin Science>Engineering>ELEC Engr Hardcover, Taylor & Francis

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Introduction to Microsystem Packaging Technology Yufeng Jin Author
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ISBN:

9781439819104


Vastly ahead of the field, this resource illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. It also details 3D-package and system-level package development with a decidedly MEMS perspective. Integrating the work of international engineers, this book presents a diversity of technologies in relation to MSP. The ultimate reference on this sophisticated level of package design and techniques, it covers encapsulation and sealing and system-in-package, as well as device-level and optoelectronics packaging. It also includes coverage of modular assembly, inspection, and reliability design, with a number of real-world case studies.

Details of the book - Introduction to Microsystem Packaging Technology Yufeng Jin Author


EAN (ISBN-13): 9781439819104
ISBN (ISBN-10): 1439819106
Hardcover
Paperback
Publishing year: 2010
Publisher: Taylor & Francis Core >2 >T
232 Pages
Language: eng/Englisch

Book in our database since 2010-03-24T08:18:20+00:00 (London)
Detail page last modified on 2023-12-11T17:17:21+00:00 (London)
ISBN/EAN: 9781439819104

ISBN - alternate spelling:
1-4398-1910-6, 978-1-4398-1910-4
Alternate spelling and related search-keywords:
Book author: chen, jin jing, wang jing
Book title: jin jing, microsystem technologies, packaging introduction

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