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Electrical Modeling and Design for 3D System Integration by Er-Ping Li Hardcover | Indigo Chapters
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Electrical Modeling and Design for 3D System Integration by Er-Ping Li Hardcover | Indigo Chapters - new book

ISBN: 9780470623466

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author''s extensive research, this book sets forth… More...

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Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity
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Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity - new book

ISBN: 9780470623466

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author''s extensive research, this book sets forth… More...

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Electrical Modeling and Design for 3D Integration - Er-Ping Li
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Er-Ping Li:
Electrical Modeling and Design for 3D Integration - hardcover

2012

ISBN: 0470623462

[EAN: 9780470623466], Neubuch, [PU: John Wiley & Sons], SCIENCE PHYSICS ELECTROMAGNETISM TECHNOLOGY & ENGINEERING ELECTRONICS CIRCUITS VLSI ULSI CIRCUIT THEORY DESIGN / ELECTRICAL ELECTRO… More...

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Electrical Modeling and Design for 3D System Integration - Er-Ping Li
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Er-Ping Li:
Electrical Modeling and Design for 3D System Integration - hardcover

2012, ISBN: 9780470623466

3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC, Buch, Hardcover, [PU: John Wiley & Sons Inc], John Wiley & Sons Inc, 2012

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Electrical Modeling and Design for 3D System Integration ? 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC - EP Li
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EP Li:
Electrical Modeling and Design for 3D System Integration ? 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC - hardcover

2012, ISBN: 9780470623466

Buch, Hardcover, [PU: John Wiley & Sons Inc], John Wiley & Sons Inc, 2012

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Electrical Modeling and Design for 3D System Integration ? 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC
Author:
Title:
ISBN:

9780470623466


The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques.

Details of the book - Electrical Modeling and Design for 3D System Integration ? 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC


EAN (ISBN-13): 9780470623466
ISBN (ISBN-10): 0470623462
Hardcover
Publishing year: 2012
Publisher: John Wiley & Sons Inc

Book in our database since 2011-12-31T22:07:52+00:00 (London)
Detail page last modified on 2023-02-16T13:16:47+00:00 (London)
ISBN/EAN: 9780470623466

ISBN - alternate spelling:
0-470-62346-2, 978-0-470-62346-6
Alternate spelling and related search-keywords:
Book author: ping
Book title: high power electronics, self packaging, circuits for power electronics, signal, whole system design, sign and design, emc, integration, integrated circuits

Information from Publisher

Author: Er-Ping Li
Title: Electrical Modeling and Design for 3D System Integration - 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
Publisher: John Wiley & Sons
384 Pages
Publishing year: 2012-04-19
Weight: 0,778 kg
Language: English
122,00 € (DE)
No longer receiving updates
158mm x 240mm x 31mm

BB; gebunden; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Schaltkreise und Komponenten (Bauteile); Elektrotechnik u. Elektronik; Circuit Theory & Design / VLSI / ULSI; Elektronikbauteile; Electronic Packaging; Schaltkreise - Theorie u. Entwurf / VLSI / ULSI; Hochfrequenztechnik; Electrical & Electronics Engineering; Elektronikbauteile; Schaltkreise - Theorie u. Entwurf / VLSI / ULSI

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: * The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems * The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias * Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations * The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards * An equivalent circuit model of through-silicon vias * Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
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