2007, ISBN: 9781574446753

The second edition of this standard-setting handbook provides an up-to-date reference to the individual processes, equipment, and materials of semiconductor manufacturing technologies. Ed… More...

The second edition of this standard-setting handbook provides an up-to-date reference to the individual processes, equipment, and materials of semiconductor manufacturing technologies. Edited by renowned experts, this book provides graphs, tables, and formulas for easy access to information as well as extensive references for further study. This edition features new and updated chapters on silicon materials, SOI materials and devices, surface preparation, ion implantation, dopant diffusion, in-line metrology, yield modeling, photomask fabrication, failure analysis, damascene copper electroplating, rapid thermal processing, interlevel dielectrics, plasma etch, atomic layer deposition, and more. Buch (fremdspr.) Yoshio (Stanford University, California, Us Nishi gebundene Ausgabe, Taylor & Francis Ltd., 09.07.2007, Taylor & Francis Ltd., 2007<

2007, ISBN: 9781574446753

The second edition of this standard-setting handbook provides an up-to-date reference to the individual processes, equipment, and materials of semiconductor manufacturing technologies. Ed… More...

The second edition of this standard-setting handbook provides an up-to-date reference to the individual processes, equipment, and materials of semiconductor manufacturing technologies. Edited by renowned experts, this book provides graphs, tables, and formulas for easy access to information as well as extensive references for further study. This edition features new and updated chapters on silicon materials, SOI materials and devices, surface preparation, ion implantation, dopant diffusion, in-line metrology, yield modeling, photomask fabrication, failure analysis, damascene copper electroplating, rapid thermal processing, interlevel dielectrics, plasma etch, atomic layer deposition, and more. Buch (fremdspr.) Yoshio (Stanford University, California, Us Nishi gebundene Ausgabe, Taylor and Francis, 09.07.2007, Taylor and Francis, 2007<

ISBN: 9781574446753

Hardback, [PU: Taylor & Francis Inc], A guide to the individual processes, equipment, and materials of semiconductor manufacturing technologies. It features chapters on silicon materials,… More...

Hardback, [PU: Taylor & Francis Inc], A guide to the individual processes, equipment, and materials of semiconductor manufacturing technologies. It features chapters on silicon materials, SOI materials and devices, surface preparation, ion implantation, dopant diffusion, in-line metrology, yield modeling, photomask fabrication, failure analysis, and damascene copper electroplating., Technology: General Issues, Industrial Chemistry & Manufacturing Technologies, Electronics Engineering, Circuits & Components, Semi-conductors & Super-conductors<

ISBN: 9781574446753

Hardback, [PU: Taylor & Francis Inc], A guide to the individual processes, equipment, and materials of semiconductor manufacturing technologies. It features chapters on silicon materials,… More...

Hardback, [PU: Taylor & Francis Inc], A guide to the individual processes, equipment, and materials of semiconductor manufacturing technologies. It features chapters on silicon materials, SOI materials and devices, surface preparation, ion implantation, dopant diffusion, in-line metrology, yield modeling, photomask fabrication, failure analysis, and damascene copper electroplating., Semi-conductors & Super-conductors<

2007, ISBN: 9781574446753

Buch, Hardcover, 2nd New edition, [PU: Crc Press Inc], Crc Press Inc, 2007