2011, ISBN: 9780470827819

Manufacturing, Reliability and Testing, eBooks, eBook Download (PDF), 1. Auflage, Although there is increasing need for modeling and simulation inthe IC package design phase, most assembl… More...

Manufacturing, Reliability and Testing, eBooks, eBook Download (PDF), 1. Auflage, Although there is increasing need for modeling and simulation inthe IC package design phase, most assembly processes and variousreliability tests are still based on the time consuming "test andtry out" method to obtain the best solution. Modeling andsimulation can easily ensure virtual Design of Experiments (DoE) toachieve the optimal solution. This has greatly reduced the cost andproduction time, especially for new product development. Usingmodeling and simulation will become increasingly necessary forfuture advances in 3D package development. In this book, Liuand Liu allow people in the area to learn the basic and advancedmodeling and simulation skills to help solve problems theyencounter. * Models and simulates numerous processes in manufacturing,reliability and testing for the first time * Provides the skills necessary for virtual prototyping andvirtual reliability qualification and testing * Demonstrates concurrent engineering and co-design approachesfor advanced engineering design of microelectronic products * Covers packaging and assembly for typical ICs, optoelectronics,MEMS, 2D/3D SiP, and nano interconnects * Appendix and color images available for download from thebook's companion website Liu and Liu have optimized the book for practicing engineers,researchers, and post-graduates in microelectronic packaging andinterconnection design, assembly manufacturing, electronicreliability/quality, and semiconductor materials. Product managers,application engineers, sales and marketing staff, who need toexplain to customers how the assembly manufacturing, reliabilityand testing will impact their products, will also find this book acritical resource. Appendix and color version of selected figures can be found atwww.wiley.com/go/liu/packaging, [PU: John Wiley & Sons], Seiten: 592, John Wiley & Sons, 2011<

ISBN: 9780470827819

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "… More...

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first timeProvides the skills necessary for virtual prototyping and virtual reliability qualification and testingDemonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic productsCovers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnectsAppendix and color images available for download from the book's companion websiteLiu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging; PDF; Scientific, Technical and Medical > Mechanical engineering & materials > Production engineering, Wiley<

ISBN: 9780470827819

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "… More...

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first timeProvides the skills necessary for virtual prototyping and virtual reliability qualification and testingDemonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic productsCovers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnectsAppendix and color images available for download from the book's companion websiteLiu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging; PDF; Scientific, Technical and Medical > Mechanical engineering & materials > Production engineering, Wiley<

2011, ISBN: 9780470827819

Manufacturing, Reliability and Testing eBook Sheng Liu#Yong Liu PDF, John Wiley & Sons, Inc., 17.08.2011, John Wiley & Sons, Inc., 2011

2011, ISBN: 9780470827819

Manufacturing, Reliability and Testing eBook Sheng Liu#Yong Liu 17.08.2011, John Wiley & Sons, Inc., John Wiley & Sons, Inc.