ISBN: 9780387281537

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as t… More...

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes. Integrated Circuit Packaging, Assembly and Interconnectionsis an introduction, a review and an update of packaging technologies. | Integrated Circuit Packaging Assembly and Interconnections by William Greig Hardcover | Indigo Chapters Books > Science & Nature > Science > Technology > Superconductors P10117, William Greig<

ISBN: 9780387281537

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as t… More...

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes. Integrated Circuit Packaging, Assembly and Interconnections is an introduction, a review and an update of packaging technologies., Springer<

2007, ISBN: 9780387281537

[ED: Gebunden], [PU: SPRINGER NATURE], Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials an… More...

[ED: Gebunden], [PU: SPRINGER NATURE], Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics., DE, [SC: 0.00], Neuware, gewerbliches Angebot, 300, [GW: 668g], 2007, Banküberweisung, PayPal, Sofortüberweisung<

2007, ISBN: 0387281533

Integrated Circuit Packaging Assembly and Interconnections ab 178.49 € als gebundene Ausgabe: Auflage 2007. Aus dem Bereich: Bücher, Wissenschaft, Technik, Medien > Bücher, SPRINGER NATURE

Integrated Circuit Packaging Assembly and Interconnections ab 178.49 € als gebundene Ausgabe: Auflage 2007. Aus dem Bereich: Bücher, Wissenschaft, Technik, Medien > Bücher, SPRINGER NATURE<

2007, ISBN: 9780387281537

Integrated Circuit Packaging Assembly and Interconnections - Auflage 2007: ab 186.49 € Bücher > Wissenschaft > Technik SPRINGER NATURE, SPRINGER NATURE