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Lowest price: € 101.99, highest price: € 113.99, average price: € 106.59
1
Modeling and Simulation for Microelectronic Packaging Assembly - Sheng Liu & Yong Liu
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Sheng Liu & Yong Liu:

Modeling and Simulation for Microelectronic Packaging Assembly - new book

2011, ISBN: 08056e45ca05aa220bbb9195f50b5ee7

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "… More...

  - Shipping costs:Download. (EUR 0.00)
2
Modeling and Simulation for Microelectronic Packaging Assembly - Sheng Liu/ Yong Liu
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€ 101.99
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Sheng Liu/ Yong Liu:

Modeling and Simulation for Microelectronic Packaging Assembly - new book

ISBN: 08056e45ca05aa220bbb9195f50b5ee7

Modeling and Simulation for Microelectronic Packaging Assembly ab 101.99 € als epub eBook: Manufacturing Reliability and Testing. Aus dem Bereich: eBooks, Sachthemen & Ratgeber, Technik, … More...

Nr. 21145667. Shipping costs:, , DE. (EUR 0.00)
3
Modeling and Simulation for Microelectronic Packaging Assembly - Sheng Liu, Yong Liu
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at Hugendubel.de
€ 101.99
Shipment: € 0.001
OrderSponsored link
Sheng Liu, Yong Liu:
Modeling and Simulation for Microelectronic Packaging Assembly - new book

ISBN: 08056e45ca05aa220bbb9195f50b5ee7

Modeling and Simulation for Microelectronic Packaging Assembly ab 101.99 € als epub eBook: Manufacturing, Reliability and Testing. Aus dem Bereich: eBooks, Belletristik, Erzählungen, Medi… More...

  - Nr. Shipping costs:, , DE. (EUR 0.00)
4
Modeling and Simulation for Microelectronic Packaging Assembly - Sheng Liu, Yong Liu
Order
at Hugendubel.de
€ 113.99
Shipment: € 0.001
OrderSponsored link
Sheng Liu, Yong Liu:
Modeling and Simulation for Microelectronic Packaging Assembly - new book

ISBN: 08056e45ca05aa220bbb9195f50b5ee7

Modeling and Simulation for Microelectronic Packaging Assembly ab 113.99 € als epub eBook: Manufacturing, Reliability and Testing. Aus dem Bereich: eBooks, Belletristik, Erzählungen, Medi… More...

  - Nr. Shipping costs:, , DE. (EUR 0.00)
5
Modeling and Simulation for Microelectronic Packaging Assembly - Sheng Liu;Yong Liu
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at eBook.de
€ 109.99
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Sheng Liu;Yong Liu:
Modeling and Simulation for Microelectronic Packaging Assembly - new book

ISBN: 08056e45ca05aa220bbb9195f50b5ee7

Manufacturing, Reliability and Testing, Manufacturing, Reliability and Testing

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Details of the book - Modeling and Simulation for Microelectronic Packaging Assembly


Publishing year: 2011
Publisher: John Wiley & Sons

Book in our database since 2014-06-12T08:34:38+01:00 (London)
Detail page last modified on 2022-01-08T14:27:42+00:00 (London)


Alternate spelling and related search-keywords:
Book author: sheng yong
Book title: modeling and simulation, microelectronic simulation packaging assembly modeling


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