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Pick-up Process Analysis of a Die Bonder - Lin, Yeong-Jyh Hwang, Sheng-Jye
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Lin, Yeong-Jyh Hwang, Sheng-Jye:

Pick-up Process Analysis of a Die Bonder - hardcover

2013, ISBN: 9783639000344

[ED: Kartoniert / Broschiert], [PU: VDM Verlag Dr. Mueller VDM Verlag Dr. Mueller e.K.], Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. T… More...

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Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method - Lin, Yeong-Jyh, Hwang, Sheng-Jye
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Lin, Yeong-Jyh, Hwang, Sheng-Jye:

Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method - Paperback

2008, ISBN: 9783639000344

VDM Verlag Dr. Müller, Paperback, 136 Seiten, Publiziert: 2008-04-17T00:00:01Z, Produktgruppe: Book, 0.19 kg, Mechanics, Civil Engineering, Engineering & Technology, Science, Nature & Mat… More...

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Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method - Sheng-Jye Hwang, Yeong-Jyh Lin
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Sheng-Jye Hwang, Yeong-Jyh Lin:
Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method - Paperback

2008

ISBN: 363900034X

[EAN: 9783639000344], Neubuch, [PU: VDM Verlag Dr. Müller], Clean and crisp and new!, Books

NEW BOOK. Shipping costs: EUR 36.35 Welcome Back Books, Toledo, OH, U.S.A. [64434632] [Rating: 5 (von 5)]
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Lin, Yeong-Jyh, and Hwang, Sheng-Jye:
Pick-up Process Analysis of a Die Bonder - Paperback

2008, ISBN: 9783639000344

Trade paperback, New., Trade paperback (US). Glued binding. 136 p., Saarbrucken, [PU: VDM Verlag Dr. Mueller E.K.]

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Yeong-Jyh Lin, Sheng-Jye Hwang:
Pick-up Process Analysis of a Die Bonder - Paperback

2008, ISBN: 9783639000344

VDM Verlag Dr. Mueller e.K, 2008-04-22. Paperback. Used:Good., VDM Verlag Dr. Mueller e.K, 2008-04-22, 0

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Details of the book
Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method
Author:
Title:
ISBN:

9783639000344


The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic; Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth; the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle; and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms; even a new procedure could be derived for the next generational die bonder.

Details of the book - Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method


EAN (ISBN-13): 9783639000344
ISBN (ISBN-10): 363900034X
Hardcover
Paperback
Publishing year: 2008
Publisher: VDM Verlag Dr. Müller
136 Pages
Weight: 0,219 kg
Language: eng/Englisch

Book in our database since 2008-12-02T14:52:03+00:00 (London)
Detail page last modified on 2023-08-08T20:14:01+01:00 (London)
ISBN/EAN: 9783639000344

ISBN - alternate spelling:
3-639-00034-X, 978-3-639-00034-4
Alternate spelling and related search-keywords:
Book author: pick, hwang, compact verlag
Book title: pick, der process, analysis, bönder

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