Hybrid Assemblies and Multichip Modules - new book
ISBN: 9781003066668
Providing a description of design considerations from the user's viewpoint this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules -… More...
Providing a description of design considerations from the user's viewpoint this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors addressing multilayer materials and overglazes; explicates design considerations such as circuit layout component placement thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing electrical and electronics and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses. Media > Books > E-books new, CRC Press<
Routledge.com
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Hybrid Assemblies and Multichip Modules - new book
ISBN: 9781003066668
Providing a description of design considerations from the user's viewpoint this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules -… More...
Providing a description of design considerations from the user's viewpoint this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors addressing multilayer materials and overglazes; explicates design considerations such as circuit layout component placement thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing electrical and electronics and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses. new, CRC Press<
Routledge.com
Shipping costs:Zzgl. Versandkosten., plus shipping costs Details...
(*) Book out-of-stock means that the book is currently not available at any of the associated platforms we search.
Hybrid Assemblies and Multichip Modules - new book
ISBN: 9781003066668
Providing a description of design considerations from the user's viewpoint this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules -… More...
Providing a description of design considerations from the user's viewpoint this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors addressing multilayer materials and overglazes; explicates design considerations such as circuit layout component placement thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing electrical and electronics and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses. Media > Books > E-books new, CRC Press<
Shipping costs:Zzgl. Versandkosten., plus shipping costs
Hybrid Assemblies and Multichip Modules - new book
ISBN: 9781003066668
Providing a description of design considerations from the user's viewpoint this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules -… More...
Providing a description of design considerations from the user's viewpoint this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors addressing multilayer materials and overglazes; explicates design considerations such as circuit layout component placement thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing electrical and electronics and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses. new, CRC Press<
Shipping costs:Zzgl. Versandkosten., plus shipping costs
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