ISBN: 9780470827802
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "… More...
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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing - hardcover
2011, ISBN: 9780470827802
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2011, ISBN: 9780470827802
Manufacturing, Reliability and Testing, Buch, Hardcover, [PU: John Wiley & Sons Inc], John Wiley & Sons Inc, 2011
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Modeling and Simulation for Microelectronic Packaging Assembly ? Manufacturing, Reliability and Testing - hardcover
2011, ISBN: 9780470827802
Buch, Hardcover, [PU: John Wiley & Sons Inc], John Wiley & Sons Inc, 2011
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2011, ISBN: 0470827807
[EAN: 9780470827802], Neubuch, [PU: John Wiley & Sons], Print on Demand pp. xxii + 564 Index, Books
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Modeling and Simulation for Microelectronic Packaging Assembly by Sheng Liu Hardcover | Indigo Chapters - new book
ISBN: 9780470827802
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "… More...
Liu, Sheng, and Liu, Yong:
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing - hardcover2011, ISBN: 9780470827802
Hard cover, Fine., 592 p. Intended for professional and scholarly audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shippi… More...
2011
ISBN: 9780470827802
Manufacturing, Reliability and Testing, Buch, Hardcover, [PU: John Wiley & Sons Inc], John Wiley & Sons Inc, 2011
Modeling and Simulation for Microelectronic Packaging Assembly ? Manufacturing, Reliability and Testing - hardcover
2011, ISBN: 9780470827802
Buch, Hardcover, [PU: John Wiley & Sons Inc], John Wiley & Sons Inc, 2011
2011, ISBN: 0470827807
[EAN: 9780470827802], Neubuch, [PU: John Wiley & Sons], Print on Demand pp. xxii + 564 Index, Books
Bibliographic data of the best matching book
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Details of the book - Modeling and Simulation for Microelectronic Packaging Assembly ? Manufacturing, Reliability and Testing
EAN (ISBN-13): 9780470827802
ISBN (ISBN-10): 0470827807
Hardcover
Publishing year: 2011
Publisher: John Wiley & Sons Inc
288 Pages
Language: eng/Englisch
Book in our database since 2011-11-17T20:33:45+00:00 (London)
Detail page last modified on 2023-02-20T14:02:45+00:00 (London)
ISBN/EAN: 9780470827802
ISBN - alternate spelling:
0-470-82780-7, 978-0-470-82780-2
Alternate spelling and related search-keywords:
Book author: sheng, yong liu
Book title: reliability modeling, self packaging, microelectronic simulation packaging assembly modeling
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