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Modeling and Simulation for Microelectronic Packaging Assembly by Sheng Liu Hardcover | Indigo Chapters
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Modeling and Simulation for Microelectronic Packaging Assembly by Sheng Liu Hardcover | Indigo Chapters - new book

ISBN: 9780470827802

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "… More...

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Liu, Sheng, and Liu, Yong:

Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing - hardcover

2011, ISBN: 9780470827802

Hard cover, Fine., 592 p. Intended for professional and scholarly audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shippi… More...

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Modeling and Simulation for Microelectronic Packaging Assembly - Sheng Liu; Yong Liu
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Sheng Liu; Yong Liu:
Modeling and Simulation for Microelectronic Packaging Assembly - hardcover

2011

ISBN: 9780470827802

Manufacturing, Reliability and Testing, Buch, Hardcover, [PU: John Wiley & Sons Inc], John Wiley & Sons Inc, 2011

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Modeling and Simulation for Microelectronic Packaging Assembly ? Manufacturing, Reliability and Testing - S Liu
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S Liu:
Modeling and Simulation for Microelectronic Packaging Assembly ? Manufacturing, Reliability and Testing - hardcover

2011, ISBN: 9780470827802

Buch, Hardcover, [PU: John Wiley & Sons Inc], John Wiley & Sons Inc, 2011

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S Liu Yong Liu Sheng Liu:
Modeling and Simulation for Microelectronic Packaging Assembly - hardcover

2011, ISBN: 0470827807

[EAN: 9780470827802], Neubuch, [PU: John Wiley & Sons], Print on Demand pp. xxii + 564 Index, Books

NEW BOOK. Shipping costs: EUR 7.92 Books Puddle, New York, NY, U.S.A. [70780988] [Rating: 5 (von 5)]

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Details of the book
Modeling and Simulation for Microelectronic Packaging Assembly ? Manufacturing, Reliability and Testing

Teaches the skills needed to shorten the time for design, manufacturing, reliability, and testing of microelectronic package assembly Liu and Liu begin with an overview of mechanics and modeling, including modeling validation tools and an explanation of concurrent engineering. They then move on to modeling in microelectronic packaging and assembly, coving packaging and assembly for typical ICs, optoelectronics, MEMS, SIP/3D, and nano interconnects. The next section explains modeling methods for package reliability and test, followed my modern modeling and simulation methodologies.Models and simulates numerous processes in manufacturing, reliability and testing for the first timeProvides the skills necessary for virtual prototyping and virtual reliability qualification and testingDemonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products.Subroutines and color images available for download from the books Companion Site

Details of the book - Modeling and Simulation for Microelectronic Packaging Assembly ? Manufacturing, Reliability and Testing


EAN (ISBN-13): 9780470827802
ISBN (ISBN-10): 0470827807
Hardcover
Publishing year: 2011
Publisher: John Wiley & Sons Inc
288 Pages
Language: eng/Englisch

Book in our database since 2011-11-17T20:33:45+00:00 (London)
Detail page last modified on 2023-02-20T14:02:45+00:00 (London)
ISBN/EAN: 9780470827802

ISBN - alternate spelling:
0-470-82780-7, 978-0-470-82780-2
Alternate spelling and related search-keywords:
Book author: sheng, yong liu
Book title: reliability modeling, self packaging, microelectronic simulation packaging assembly modeling


Information from Publisher

Author: J. Liu
Title: Modeling and Simulation for Microelectronic Packaging Assembly - Manufacturing, Reliability and Testing
Publisher: John Wiley & Sons
592 Pages
Publishing year: 2011-10-21
Weight: 1,200 kg
Language: English
132,00 € (DE)
No longer receiving updates
168mm x 244mm x 15mm

BB; gebunden; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Schaltkreise und Komponenten (Bauteile); Elektronische Baugruppe; Elektrotechnik u. Elektronik; Electronic Packaging; Elektronikbauteile; Electrical & Electronics Engineering; Elektronikbauteile

Foreword by C. P. Wong xiii Foreword by Zhigang Suo xv Preface xvii Acknowledgments xix About the Authors xxi Part I Mechanics and Modeling 1 1 Constitutive Models and Finite Element Method 3 1.1 Constitutive Models for Typical Materials 3 1.2 Finite Element Method 9 1.3 Chapter Summary 18 References 19 2 Material and Structural Testing for Small Samples 21 2.1 Material Testing for Solder Joints 21 2.2 Scale Effect of Packaging Materials 32 2.3 Two-Ball Joint Specimen Fatigue Testing 41 2.4 Chapter Summary 41 References 43 3 Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution 45 3.1 Constitutive Model for Tin-Lead Solder Joint 45 3.2 Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills 50 3.3 A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys 56 3.4 User-Supplied Subroutines for Solders Considering Damage Evolution 67 3.5 Chapter Summary 76 References 76 4 Accelerated Fatigue Life Assessment Approaches for Solders in Packages 79 4.1 Life Prediction Methodology 79 4.2 Accelerated Testing Methodology 82 4.3 Constitutive Modeling Methodology 83 4.4 Solder Joint Reliability via FEA 84 4.5 Life Prediction of Flip-Chip Packages 93 4.6 Chapter Summary 99 References 99 5 Multi-Physics and Multi-Scale Modeling 103 5.1 Multi-Physics Modeling 103 5.2 Multi-Scale Modeling 106 5.3 Chapter Summary 107 References 108 6 Modeling Validation Tools 109 6.1 Structural Mechanics Analysis 109 6.2 Requirements of Experimental Methods for Structural Mechanics Analysis 111 6.3 Whole Field Optical Techniques 112 6.4 Thermal Strains Measurements Using Moire Interferometry 113 6.5 In-Situ Measurements on Micro-Machined Sensors 116 6.6 Real-Time Measurements Using Speckle Interferometry 119 6.7 Image Processing and Computer Aided Optical Techniques 120 6.8 Real-Time Thermal-Mechanical Loading Tools 123 6.9 Warpage Measurement Using PM-SM System 124 6.10 Chapter Summary 131 References 131 7 Application of Fracture Mechanics 135 7.1 Fundamental of Fracture Mechanics 135 7.2 Bulk Material Cracks in Electronic Packages 141 7.3 Interfacial Fracture Toughness 148 7.4 Three-Dimensional Energy Release Rate Calculation 159 7.5 Chapter Summary 165 References 165 8 Concurrent Engineering for Microelectronics 169 8.1 Design Optimization 169 8.2 New Developments and Trends in Integrated Design Tools 179 8.3 Chapter Summary 183 References 183 Part II Modeling in Microelectronic Packaging and Assembly 185 9 Typical IC Packaging and Assembly Processes 187 9.1 Wafer Process and Thinning 188 9.2 Die Pick Up 193 9.3 Die Attach 198 9.4 Wire Bonding 206 9.5 Molding 223 9.6 Leadframe Forming/Singulation 241 9.7 Chapter Summary 252 References 252 10 Opto Packaging and Assembly 255 10.1 Silicon Substrate Based Opto Package Assembly 255 10.2 Welding of a Pump Laser Module 258 10.3 Chapter Summary 264 References 264 11 MEMS and MEMS Package Assembly 267 11.1 A Pressure Sensor Packaging (Deformation and Stress) 267 11.2 Mounting of Pressure Sensor 273 11.3 Thermo-Fluid Based Accelerometer Packaging 279 11.4 Plastic Packaging for a Capacitance Based Accelerometer 288 11.5 Tire Pressure Monitoring System (TPMS) Antenna 303 11.6 Thermo-Fluid Based Gyroscope Packaging 310 11.7 Microjets for Radar and LED Cooling 316 11.8 Air Flow Sensor 327 11.9 Direct Numerical Simulation of Particle Separation by Direct Current Dielectrophoresis 335 11.10 Modeling of Micro-Machine for Use in Gastrointestinal Endoscopy 341 11.11 Chapter Summary 353 References 354 12 System in Package (SIP) Assembly 361 12.1 Assembly Process of Side by Side Placed SIP 361 12.2 Impact of the Nonlinear Materials Behaviors on the Flip-Chip Packaging Assembly Reliability 369 12.3 Stacked Die Flip-Chip Assembly Layout and the Material Selection 381 12.4 Chapter Summary 393 References 393 Part III Modeling in Microelectronic Package Reliability and Test 395 13 Wafer Probing Test 397 13.1 Probe Test Model 397 13.2 Parameter Probe Test Modeling Results and Discussions 400 13.3 Comparison Modeling: Probe Test versus Wire Bonding 406 13.4 Design of Experiment (DOE) Study and Correlation of Probing Experiment and FEA Modeling 409 13.5 Chapter Summary 411 References 412 14 Power and Thermal Cycling, Solder Joint Fatigue Life 413 14.1 Die Attach Process and Material Relations 413 14.2 Power Cycling Modeling and Discussion 413 14.3 Thermal Cycling Modeling and Discussion 420 14.4 Methodology of Solder Joint Fatigue Life Prediction 426 14.5 Fatigue Life Prediction of a Stack Die Flip-Chip on Silicon (FSBGA) 427 14.6 Effect of Cleaned and Non-Cleaned Situations on the Reliability of Flip-Chip Packages 434 14.7 Chapter Summary 438 References 439 15 Passivation Crack Avoidance 441 15.1 Ratcheting-Induced Stable Cracking: A Synopsis 441 15.2 Ratcheting in Metal Films 445 15.3 Cracking in Passivation Films 447 15.4 Design Modifications 452 15.5 Chapter Summary 452 References 452 16 Drop Test 453 16.1 Controlled Pulse Drop Test 453 16.2 Free Drop 460 16.3 Portable Electronic Devices Drop Test and Simulation 467 16.4 Chapter Summary 470 References 471 17 Electromigration 473 17.1 Basic Migration Formulation and Algorithm 473 17.2 Electromigration Examples from IC Device and Package 477 17.3 Chapter Summary 496 References 497 18 Popcorning in Plastic Packages 499 18.1 Statement of Problem 499 18.2 Analysis 501 18.3 Results and Comparisons 503 18.4 Chapter Summary 515 References 516 Part IV Modern Modeling and Simulation Methodologies: Application to Nano Packaging 519 19 Classical Molecular Dynamics 521 19.1 General Description of Molecular Dynamics Method 521 19.2 Mechanism of Carbon Nanotube Welding onto the Metal 522 19.3 Applications of Car-Parrinello Molecular Dynamics 530 19.4 Nano-Welding by RF Heating 544 19.5 Chapter Summary 548 References 548 Index 553

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