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Lowest price: € 100.68, highest price: € 179.88, average price: € 142.26
Modeling and Simulation for Microelectronic Packaging Assembly - Liu, Yong; Liu, Sheng
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Liu, Yong; Liu, Sheng:
Modeling and Simulation for Microelectronic Packaging Assembly - new book

ISBN: 9780470827802

ID: 818629

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development.  In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter.   Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging Technology Technology eBook, Wiley

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Modeling and Simulation for Microelectronic Packaging Assembly - Sheng Liu#Yong Liu
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Sheng Liu#Yong Liu:
Modeling and Simulation for Microelectronic Packaging Assembly - new book

2011, ISBN: 9780470827802

ID: 843180318

Manufacturing, Reliability and Testing. Companion Website Manufacturing, Reliability and Testing. Companion Website Buch (fremdspr.) gebundene Ausgabe 21.10.2011 Bücher>Fremdsprachige Bücher>Englische Bücher, John Wiley & Sons Inc, .201

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Modeling and Simulation for Microelectronic Packaging Assembly - Sheng Liu#Yong Liu
book is out-of-stock
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Sheng Liu#Yong Liu:
Modeling and Simulation for Microelectronic Packaging Assembly - new book

ISBN: 9780470827802

ID: 836786764

Manufacturing, Reliability and Testing. Companion Website Manufacturing, Reliability and Testing. Companion Website Buch (fremdspr.) Bücher>Fremdsprachige Bücher>Englische Bücher, John Wiley & Sons, Ltd.

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Modeling and Simulation for Microelectronic Packaging Assembly
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Modeling and Simulation for Microelectronic Packaging Assembly - new book

ISBN: 9780470827802

ID: 9780470827802

This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation-- Books, [PU: Wiley]

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Modeling and Simulation for Microelectronic Packaging Assembly - Sheng Liu; Yong Liu
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Sheng Liu; Yong Liu:
Modeling and Simulation for Microelectronic Packaging Assembly - hardcover

2011, ISBN: 9780470827802

ID: 17104391

Manufacturing, Reliability and Testing, Hardcover, Buch, [PU: Wiley-Blackwell]

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Details of the book
Modeling and Simulation for Packaging Assembly: Manufacture, Reliability and Testing

Teaches the skills needed to shorten the time for design, manufacturing, reliability, and testing of microelectronic package assembly Liu and Liu begin with an overview of mechanics and modeling, including modeling validation tools and an explanation of concurrent engineering. They then move on to modeling in microelectronic packaging and assembly, coving packaging and assembly for typical ICs, optoelectronics, MEMS, SIP/3D, and nano interconnects. The next section explains modeling methods for package reliability and test, followed my modern modeling and simulation methodologies.Models and simulates numerous processes in manufacturing, reliability and testing for the first timeProvides the skills necessary for virtual prototyping and virtual reliability qualification and testingDemonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products.Subroutines and color images available for download from the books Companion Site

Details of the book - Modeling and Simulation for Packaging Assembly: Manufacture, Reliability and Testing


EAN (ISBN-13): 9780470827802
ISBN (ISBN-10): 0470827807
Hardcover
Publishing year: 2011
Publisher: John Wiley & Sons
288 Pages
Language: eng/Englisch

Book in our database since 17.11.2011 21:33:45
Book found last time on 11.09.2018 13:35:42
ISBN/EAN: 9780470827802

ISBN - alternate spelling:
0-470-82780-7, 978-0-470-82780-2


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