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Integrated Circuit Packaging, Assembly and Interconnections - Maurizio Fanciulli
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Integrated Circuit Packaging, Assembly and Interconnections - new book

ISBN: 9780387339139

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as t… More...

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Integrated Circuit Packaging, Assembly and Interconnections
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Integrated Circuit Packaging, Assembly and Interconnections - new book

ISBN: 9780387339139

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as t… More...

Nr. 978-0-387-33913-9. Shipping costs:Worldwide free shipping, , DE. (EUR 0.00)
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Integrated Circuit Packaging Assembly and Interconnections - William Greig
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William Greig:
Integrated Circuit Packaging Assembly and Interconnections - new book

ISBN: 9780387339139

Integrated Circuit Packaging Assembly and Interconnections ab 117.49 € als pdf eBook: . Aus dem Bereich: eBooks, Sachthemen & Ratgeber, Technik, Medien > Bücher nein eBook als pdf eBooks … More...

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Integrated Circuit Packaging Assembly and Interconnections - William Greig
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William Greig:
Integrated Circuit Packaging Assembly and Interconnections - new book

ISBN: 9780387339139

*Integrated Circuit Packaging Assembly and Interconnections* / pdf eBook für 117.49 € / Aus dem Bereich: eBooks, Sachthemen & Ratgeber, Technik Medien > Bücher nein eBook als pdf eBooks >… More...

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Integrated Circuit Packaging, Assembly and Interconnections - Steven L Suib
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Steven L Suib:
Integrated Circuit Packaging, Assembly and Interconnections - new book

ISBN: 9780387339139

; EPUB; Scientific, Technical and Medical > Electronics & communications engineering > Electronics engineeri, Elsevier Science

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Integrated Circuit Packaging Assembly and Interconnections
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ISBN:

9780387339139

Details of the book - Integrated Circuit Packaging Assembly and Interconnections


EAN (ISBN-13): 9780387339139
ISBN (ISBN-10): 0387339132
Publishing year: 2007
Publisher: Springer-Verlag GmbH
300 Pages
Language: eng/Englisch

Book in our database since 2007-11-07T22:09:32+00:00 (London)
Detail page last modified on 2024-01-26T14:47:05+00:00 (London)
ISBN/EAN: 9780387339139

ISBN - alternate spelling:
0-387-33913-2, 978-0-387-33913-9
Alternate spelling and related search-keywords:
Book author: greig
Book title: interconnections, packaging, around the circuit, assembly, integrated

Information from Publisher

Author: William Greig
Title: Integrated Circuit Packaging, Assembly and Interconnections
Publisher: Springer; Springer US
300 Pages
Publishing year: 2007-04-24
New York; NY; US
Language: English
96,29 € (DE)
99,00 € (AT)
118,00 CHF (CH)
Available
XXVIII, 300 p. 75 illus.

EA; E107; eBook; Nonbooks, PBS / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; circuit; integrated circuit; manufacturing; material; packaging; thin films; C; Electronics and Microelectronics, Instrumentation; Electronic Circuits and Systems; Engineering Design; Optical Materials; Engineering; Schaltkreise und Komponenten (Bauteile); Konstruktion, Entwurf; Technische Anwendung von elektronischen, magnetischen, optischen Materialien; BB

Electronic Manufacturing and the Integrated Circuit.- Integrated Circuit Manufacturing: A Technology Resource.- Packaging the IC—Single Chip Packaging.- The Chip Scale Package.- Multichip Packaging.- Known Good Die (KGD).- Packaging Options—Chip on Board.- Chip & Wire Assembly.- Tape Automated Bonding—TAB.- Flip Chip—The Bumping Processes.- Flip Chip Assembly.- HDI Substrate Manufacturing Technologies: Thin Film Technology.- HDI Substrate Manufacturing Technologies: Thick Film Technology.- HDI Substrate Manufacturing Technologies: Cofired Ceramic.- Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate.
Delivers the information designers need to implement the right packaging approach for their specific application Explains tradeoffs to be made at each level of packaging to form the most reliable product at the lowest cost Focuses on how package trends and assembly options are impacted by the IC and its mechanical, electrical, and thermal characteristics Identifies the IC manufacturing process (Wafer Fab) as a technology resource for the manufacture of high density interconnects Highlights flip chip as the next generation first level interconnect A comprehensive glossary of terms is included Includes supplementary material: sn.pub/extras;
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