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Lee, Yung-Cheng:

Manufacturing Aspects in Electronic Packaging: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, Califo (Htd) - Paperback

1992, ISBN: 9780791811122

American Society of Civil Engineers … More...

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Lee, Yung-Cheng:

Manufacturing Aspects in Electronic Packaging: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, Califo (Htd) - Paperback

1992, ISBN: 0791811123

[EAN: 9780791811122], Used, as new, [PU: American Society of Civil Engineers], Like New. Ships from multiple locations, Books

NOT NEW BOOK. Shipping costs: EUR 21.53 Mispah books, Redhill, SURRE, United Kingdom [82663586] [Rating: 4 (of 5)]
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Lee, Yung-Cheng:
Manufacturing Aspects in Electronic Packaging: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, Califo (Htd) - Paperback

1992

ISBN: 0791811123

[EAN: 9780791811122], Used, as new, [PU: American Society of Civil Engineers], As New

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Editor-Y. C. Lee; Editor-T. J. Bennett:
Manufacturing Aspects in Electronic Packaging (Eep) - Paperback

1992, ISBN: 9780791811122

Hardcover, Used, Buy with confidence. Excellent Customer Service & Return policy. Ships Fast. 24*7 Customer Service., [PU: American Society of Civil Engineers]

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Editor-Y. C. Lee; Editor-T. J. Bennett:
Manufacturing Aspects in Electronic Packaging (EEP) - hardcover

1992, ISBN: 9780791811122

American Society of Civil Engineers, 1992-12. Hardcover. Good., American Society of Civil Engineers, 1992-12

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0791811123

Details of the book - Manufacturing Aspects in Electronic Packaging


EAN (ISBN-13): 9780791811122
ISBN (ISBN-10): 0791811123
Hardcover
Paperback
Publishing year: 1992
Publisher: American Society of Civil Engineers

Book in our database since 2008-06-17T14:08:59+01:00 (London)
Detail page last modified on 2022-10-06T21:37:07+01:00 (London)
ISBN/EAN: 0791811123

ISBN - alternate spelling:
0-7918-1112-3, 978-0-7918-1112-2
Alternate spelling and related search-keywords:
Book author: bennett
Book title: htd, aspects

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