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Brown, William D.:

Advanced Electronic Packaging: With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems) - hardcover

1998, ISBN: 0780347005

[EAN: 9780780347007], Gebraucht, guter Zustand, [PU: Wiley-IEEE Press], Spine creases, wear to binding and pages from reading. May contain limited notes, underlining or highlighting that … More...

NOT NEW BOOK. Shipping costs: EUR 7.68 Bayside Books, Ogden, UT, U.S.A. [64434477] [Rating: 5 (von 5)]
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Brown, William D. [Editor]:

Advanced Electronic Packaging: With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems) Brown, William D - hardcover

1998, ISBN: 9780780347007

Wiley-IEEE Press, 1998-10-27. Hardcover. Very Good. Book is in very nice condition, text is unmarked and pages are tight., Wiley-IEEE Press, 1998-10-27, 3

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Advanced Electronic Packaging: With Emphasis on Multichip Modules (Ieee Press Series on Microelectronic Systems) - used book

1998

ISBN: 9780780347007

Gebraucht, guter Zustand, USED We here at Elistics have a 100% satisfaction guarentee. Thank you for your business., [PU: Wiley-IEEE Press]

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Advanced Electronic Packaging: With Emphasis on Multichip Modules - Brown, William D.
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Brown, William D.:
Advanced Electronic Packaging: With Emphasis on Multichip Modules - used book

1998, ISBN: 9780780347007

Hardcover book. 784 pages. Published by IEEE Computer Society Press (1998) Media > Book, [PU: Institute of Electrical and Electronics Engineers (IEEE)]

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Editor-William D. Brown:
Advanced Electronic Packaging: With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems) - hardcover

1998, ISBN: 9780780347007

Wiley-IEEE Press, 1998-10-13. Hardcover. Good., Wiley-IEEE Press, 1998-10-13, 2.5

Shipping costs: EUR 11.09 Ergodebooks

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Details of the book
Advanced Electronic Packaging: With Emphasis on Multichip Modules

Electrical Engineering Advanced Electronic Packaging With Emphasis on Multichip Modules Packaging is rapidly becoming an area of microelectronics technology that can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems. With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics. An excellent desk reference for practicing engineers or an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the packaging of integrated circuits, specifically, multichip modules (MCMs). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design trade offs. Also addressed are the critical role of economics and future trends in electronic packaging.

Details of the book - Advanced Electronic Packaging: With Emphasis on Multichip Modules


EAN (ISBN-13): 9780780347007
ISBN (ISBN-10): 0780347005
Hardcover
Publishing year: 1998
Publisher: INST OF ELECTRICAL & ELEC
784 Pages
Weight: 1,592 kg
Language: eng/Englisch

Book in our database since 2007-01-28T20:11:32+00:00 (London)
Book found last time on 2021-08-12T08:30:08+01:00 (London)
ISBN/EAN: 0780347005

ISBN - alternate spelling:
0-7803-4700-5, 978-0-7803-4700-7
Alternate spelling and related search-keywords:
Book author: william brown, ieee
Book title: microelectronic, advanced packaging


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