2025, ISBN: 9789814273329

[ED: Buch], [PU: World Scientific Publishing Company], Neuware - Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circu… More...

[ED: Buch], [PU: World Scientific Publishing Company], Neuware - Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained.The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed.- Besorgungstitel - vorauss. Lieferzeit 3-5 Tage., DE, [SC: 2.70], Neuware, gewerbliches Angebot, 235x157x21 mm, 312, [GW: 607g], Banküberweisung, Offene Rechnung, Kreditkarte, PayPal, Offene Rechnung (Vorkasse vorbehalten), Internationaler Versand<

ISBN: 9789814273329

Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on ele… More...

Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. | Electromigration in Ulsi Interconnections by Cher Ming Tan Hardcover | Indigo Chapters Books > Science & Nature > Science > Technology > Superconductors P10117, Cher Ming Tan<

2010, ISBN: 9789814273329

Wspc, Gebundene Ausgabe, Auflage: Illustrated, 312 Seiten, Publiziert: 2010-06-25T00:00:01Z, Produktgruppe: Buch, Hersteller-Nr.: NUSTBK20171230-C0025961, 1.3 kg, Elektrotechnik, Ingenieu… More...

Wspc, Gebundene Ausgabe, Auflage: Illustrated, 312 Seiten, Publiziert: 2010-06-25T00:00:01Z, Produktgruppe: Buch, Hersteller-Nr.: NUSTBK20171230-C0025961, 1.3 kg, Elektrotechnik, Ingenieurwissenschaft & Technik, Naturwissenschaften & Technik, Kategorien, Bücher, Verschiedenes, Format: Illustriert, Wspc, 2010<

ISBN: 9789814273329

Fnac.com : Electromigration in Ulsi Interconnections, International Series on Advances in Solid State Electronics and Technology - Livre. Découvrez des nouveautés, des coups de cœur, des… More...

Fnac.com : Electromigration in Ulsi Interconnections, International Series on Advances in Solid State Electronics and Technology - Livre. Découvrez des nouveautés, des coups de cœur, des avis d'internautes, … Livre - Livre, World Scientific Pub Co Inc<

2010, ISBN: 9814273325

Gebundene Ausgabe TECHNOLOGY & ENGINEERING / Electronics / Semiconductors, mit Schutzumschlag 11, [PU:World Scientific Publishing Company]