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Ramm:

Handbook of Wafer Bonding - new book

2006, ISBN: 9783527326464

[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… More...

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Ramm:

Handbook of Wafer Bonding - new book

2006, ISBN: 9783527326464

[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… More...

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Ramm:
Handbook of Wafer Bonding - new book

2006

ISBN: 9783527326464

[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… More...

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Handbook of Wafer Bonding - Ramm
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Ramm:
Handbook of Wafer Bonding - hardcover

2012, ISBN: 3527326464

Gebundene Ausgabe Elektronik / Halbleiter, Halbleiter, Leitung (physikalisch) / Halbleiter, Materialwissenschaft, Nanotechnologie, Technologie / Nanotechnologie, mit Schutzumschlag 11, [… More...

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Handbook of Wafer Bonding - Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo
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Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo:
Handbook of Wafer Bonding - hardcover

ISBN: 9783527326464

hardback, [PU: Wiley-VCH, Weinheim]

in stock. Shipping costs:Usually dispatched within 48 hours. (EUR 7.60) Blackwells.co.uk

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Bibliographic data of the best matching book

Details of the book
Handbook of Wafer Bonding

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.

Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.

This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Details of the book - Handbook of Wafer Bonding


EAN (ISBN-13): 9783527326464
ISBN (ISBN-10): 3527326464
Hardcover
Publishing year: 2012
Publisher: Wiley-VCH
395 Pages
Weight: 0,937 kg
Language: Englisch

Book in our database since 2008-09-14T14:42:19+01:00 (London)
Detail page last modified on 2024-01-24T19:43:42+00:00 (London)
ISBN/EAN: 9783527326464

ISBN - alternate spelling:
3-527-32646-4, 978-3-527-32646-4
Alternate spelling and related search-keywords:
Book author: ramm, peter james, peter troy, jia, jian, wiley vch verlag gmbh
Book title: bon, bonding, bond, handbook


Information from Publisher

Author: Peter Ramm; James Jian-Qiang Lu; Maaike M. V. Taklo
Title: Handbook of Wafer Bonding
Publisher: Wiley-VCH; Wiley-VCH
396 Pages
Publishing year: 2012-01-11
Printed / Made in
Weight: 0,924 kg
Language: English
185,00 € (DE)
190,20 € (AT)
Available
170mm x 240mm x 26mm

BB; Hardcover, Softcover / Chemie/Sonstiges; Nanowissenschaften; Verstehen; Chemie; Components & Devices; Electrical & Electronics Engineering; Elektrotechnik u. Elektronik; Halbleiterphysik; Komponenten u. Bauelemente; MEMS; Mikrosystemtechnik; Nanomaterial; Nanomaterialien; Nanomaterials; Nanostrukturiertes Material; Nanotechnologie; Nanotechnology; Physics; Physik; Semiconductor Physics; Wafer; MEMS; Komponenten u. Bauelemente; Nanomaterialien; Halbleiterphysik; Nanotechnologie

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories - Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

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9783527644230 Handbook of Wafer Bonding (Wiley-VCH)


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